Browsing by Author "Lambrinou, Konstantza"
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Publication A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Journal article2009, Journal of Electronic Materials, (38) 9, p.1881-1895Publication Factors affecting the bulk embrittlement of Pb-free solders
Lambrinou, KonstantzaBook chapter2011Publication Formation of a metastable celsian-cordierite eutectic structure during the crystallization of a Ba-osumilite glass-ceramic
;Lambrinou, Konstantza ;Vleugels, JozefBoccaccini, Aldo R.Journal article2007, Journal of the American Ceramic Society, (90) 2, p.590-597Publication Low-temperature enbrittlement of lead-free solders in joint level impact testing
Proceedings paper2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151Publication Resonant-based identification of the elastic properties of the layered materials: Application to air-plasma sprayed thermal barrier coatings
;Lauwagie, Tom ;Lambrinou, Konstantza ;Patsias, Sophoclis ;Heylen, WardVleugels, JozefJournal article2008, NDT & E International, 41, p.88-97Publication Resonant-based identification of the Poisson's ratio of orthotropic materials
;Lauwagie, Tom ;Lambrinou, Konstantza ;Sol, HugoHeylen, WardJournal article2010, Experimental Mechanics, (50) 4, p.437-447Publication Study of the mechanism of bulk embrittlement of Sn-based Pb-free solders
Proceedings paper2008, European Electronics Assembly Reliability Summit, 22/10/2008Publication The microstructural aspect of the ductile-to-brittle transition of Tin-based lead-free solders
;Lambrinou, KonstantzaEngelmaier, WernerJournal article2010, Journal of ASTM International, (7) 7, p.JAI103064Publication Towards the understanding of resistive contrast imaging in in situ dielectric breakdown studies using a nanoprober setup
Proceedings paper2010, Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics, 5/04/2010, p.1249-F08-14