Browsing by Author "Lechleiter, F."

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High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

Beyne, Eric
;
Van Hoof, Rita
;
Webers, Tomas
;
Brebels, Steven
;
Rossi, S.
;
Lechleiter, F.
;
Di Ianni, M.
Journal article
2001, Microelectronics International, (18) 3, p.36-42
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)

Beyne, Eric
;
Van Hoof, Rita
;
Webers, Tomas
;
Rossi, S.
;
Lechleiter, F.
;
Di Ianni, M.
;
Ostmann, A.
Proceedings paper
2000, Proceedings 2000 International Symposium on Microelectronics, 18/09/2000, p.229-234