Browsing by Author "Li, Hai"
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Publication Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test-Part I
Editorial material2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 15, 3Publication Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II
Editorial material2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 15, 4Publication Quantification of spin-charge interconversion in highly resistive sputtered BixSe1-x with nonlocal spin valves
Journal article2023, PHYSICAL REVIEW B, (108) 10, p.Art. 104425