Browsing by Author "Li, Yanan"
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Publication 2 μm Pitch Direct Die-To-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning And Die Singulation
Proceedings paper2025, 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2025-05-27, p.272Publication Selective Tuning of Perpendicular Magnetic Anisotropy and Dzyaloshinskii-Moriya Interaction in Heterostructures Compatible with Magnetic Tunnel Junctions
Journal article2026, ADVANCED ELECTRONIC MATERIALS, (12) 18, p.e70536