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Browsing by Author "Li, Yanan"

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    2 μm Pitch Direct Die-To-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning And Die Singulation

    Lin, Ye  
    ;
    Bex, Pieter  
    ;
    Suhard, Samuel  
    ;
    Zhang, Boyao  
    ;
    Ulu Okudur, Fulya  
    ;
    Diaz De Zerio, Amaia
    Proceedings paper
    2025-01-01, 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2025-05-27, p.272

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