Browsing by Author "Määttänen, Jarmo"
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Publication Low temperature flip chip attachment for flexible display applications
Proceedings paper2004, International Conference on Electronics Packaging - ICEP, 14/04/2004, p.307-312Publication Low temperature flip chip with adhesives on PES
Proceedings paper2003, 14th European Microelectronics and Packaging Conference & Exhibition, 23/06/2003, p.319-324Publication Reliability results of high density flip chip on flex assemblies
Proceedings paper2004, Elektroniikan Valmistus 2004, Elektroniikan tuotanto-ja pakkaustekniikan konferenssii, 13/05/2004, p.89-93Publication Results of a high density flip chip on flex reliability test program
Proceedings paper2003, 26th International Spring Seminar on Electronics Technology. Integrated Management of Electronic Materials Production. ISSE, 8/05/2003, p.1-6