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Browsing by Author "Matterne, Mireille"

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    Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliability

    Wang, Teng
    ;
    De Messemaeker, Joke  
    ;
    Cherman, Vladimir  
    ;
    Kay, Alvin Chow Chee
    ;
    Cadacio Jr., Francisco
    Proceedings paper
    2015, Electronic Packaging Technology Conference - EPTC, 2/12/2015

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