Browsing by Author "Maurissen, Wout"
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Publication A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Journal article2009, Journal of Electronic Materials, (38) 9, p.1881-1895Publication Low-temperature enbrittlement of lead-free solders in joint level impact testing
Proceedings paper2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151