Browsing by Author "Mayer, Dieter"
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Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
Meeting abstract2016, 13th Annual International Wafer-Level Packaging Conference - IWLPC, 18/10/2016Publication Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
; ; ; ; Journal article2017, Chip Scale Review, (21) 1, p.28-32Publication Metallization of organic surfaces: Pd on thiazole