Browsing by Author "Merkel, R."
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Publication 3D TSV based high frequency components for RF IC and RF MEMS applications
;Fernandez-Bolanos, Montserrat ;Vitale, Wolfgang ;Maqueda Lopez, MariazelIonescu, Adrian M.Proceedings paper2016, IEEE 3D System Integration Conference - 3DIC, 9/11/2016, p.1-4