Browsing by Author "Min, Woo Sig"
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Publication Electroless copper deposition on TiN
Oral presentation1997, 1997 Joint International Meeting ECS (Electrochemical Society) and ISE (International Society of Electrochemistry) : Symposium oPublication Electroless deposition of Cu with solutions containing either Mg2+ or Pd2+ ions
Journal article1999, Physica Scripta, T79, p.232-235Publication New plating path for electroless copper deposition on sputtered barrier layers
Oral presentation1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.Publication The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Proceedings paper1999, Advanced Metallization Conference in 1998 - AMC 1998, 6/10/1998, p.65-71Publication The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Oral presentation1998, Advanced Metallization Conference; 6-8 Oct. 1998; Colorado Springs, USA.