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    Technology for embedding active dies

    Ostmann, A.
    ;
    De Baets, Johan  
    ;
    Kriechbaum, A.
    ;
    Kostner, H.
    ;
    Neumann, A.
    Proceedings paper
    2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference - IMAPS, 12/06/2005, p.101-106

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