Browsing by Author "Nishida, Yoshiteru"
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Publication Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process
Proceedings paper2012, 4th Electronics System Integration Technology Conference - ESTC, 17/09/2012Publication Wafer backside thinning process integrated with post-thinning clean and TSV exposure recess etch
Proceedings paper2012, China Semiconductor Technology International Conference - CSTIC, 18/03/2012, p.865-870