Browsing by Author "Noda, Hiroto"
Now showing 1 - 1 of 1
- Results per page
- Sort Options
Publication An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.1677-1681