Browsing by Author "Ostmann, A."
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Publication Cost modelling for embedded component technology
Proceedings paper2007-06, 16th European Microelectronics and Packaging Conference - EMPC, 17/06/2007, p.341-344Publication High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
; ; ; ; Publication High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SUD)
Proceedings paper2000, Proceedings 2000 International Symposium on Microelectronics, 18/09/2000, p.229-234Publication HIPERPRINT= a board technology for high-frequency applications
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.326-332Publication Lead-free flip chip: a comparison between lead-free solder and adhesives
Proceedings paper2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC, 12/06/2005, p.434-439Publication Stretchable conductor technology for elastic electronic systems
Proceedings paper2007-03, IMAPS MicroTech: Advanced Interconnection, 6/03/2007Publication Technology for embedding active dies
Proceedings paper2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference - IMAPS, 12/06/2005, p.101-106