Browsing by Author "Pavel, Elisabeth"
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Publication A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
; ; ; ; Proceedings paper2007, Advances in Resist Materials and Processing Technology XXIV, 25/02/2007, p.65190UPublication The effect of etch-clean delay time on post-etch residue removal for front-end-of-line applications
Journal article2009, Journal of Vacuum Science and Technology B, (27) 5, p.2301-2308