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Browsing by Author "Peng, L."

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    Publication

    Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

    Vandooren, Anne  
    ;
    Witters, Liesbeth  
    ;
    Franco, Jacopo  
    ;
    Mallik, Arindam  
    ;
    Parvais, Bertrand  
    ;
    Wu, Z.
    Proceedings paper
    2018, International Conference on IC Design and Technology - ICICDT, 4/06/2018, p.145-148

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