Browsing by Author "Podprocky, T."
Now showing 1 - 3 of 3
- Results per page
- Sort Options
Publication High density flip chip with adhesives on ceramics
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.175-180Publication Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA
Meeting abstract2002, IMAPS Flip-Chip Technology Workshop and Exhibition, 24/06/2002Publication Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application
Proceedings paper2002, Proceedings of the 4th Electronics Packaging Technology Conference - EPTC, 10/12/2002, p.139-143