Browsing by Author "Pozza, G."
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Publication Analysis of local mechanical stresses in and near tungsten lines on silicon substrates
Journal article1999, J. Appl. Phys., (85) 9, p.6477-6485Publication Damage evolution and mechanical failure in flip-chip interconnects
Proceedings paper1998, Electronic Packaging and Materials Science X, 14/04/1998, p.105-110Publication Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections
Proceedings paper1997, Proceedings of the International Conference and Exhibition Micro Materials - Micro Mat, 16/04/1997, p.261-266