Browsing by Author "Raedschelders, E."
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Publication HIPERPRINT= a board technology for high-frequency applications
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.326-332Publication Mixed component integration in advanced printed wiring boards
Proceedings paper1999, EC-MCM - The 5th European Conference on MultiChip Modules, 1/02/1999Publication Mixed component integration in MCM-L technology
Proceedings paper1999, CARTS Europe - 13th European Passive Components Symposium, 18/10/1999, p.113-118Publication Standard SMT process for flip-chip assembly on FR4 substrate