Browsing by Author "Ramm, P."
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Publication 3D integration technology: status and application development
Proceedings paper2010, 40th European Solid-State Device Research Conference - ESSDERC, 13/09/2010, p.9-16Publication 3D TSV based high frequency components for RF IC and RF MEMS applications
;Fernandez-Bolanos, Montserrat ;Vitale, Wolfgang ;Maqueda Lopez, MariazelIonescu, Adrian M.Proceedings paper2016, IEEE 3D System Integration Conference - 3DIC, 9/11/2016, p.1-4