Browsing by Author "Reese, E."
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Publication Electro-conductive adhesives for high density package and flip-chip interconnections
Journal article2000, Microelectronics Reliability, (40) 7, p.1215-1226Publication Fine pitch interconnection using anisotropic conducting adhesives
Publication New adhesives for high density flip-chip interconnections
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.224-229