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Browsing by Author "Sauter, Wolfgang"

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    BGA electromigration behavior and why it has become the bottleneck

    Labie, Riet  
    ;
    Nawghane, Chinmay  
    ;
    Tsiakos, Dimitrios  
    ;
    Mertens, Jan  
    ;
    Tremble, Eric
    ;
    Graf, Richard
    Proceedings paper
    2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.678-684
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    Thermal analysis and electromigration behaviour in BGA packages: investigating the impact of electric current and resultant Joule heating on temperature distribution

    Nawghane, Chinmay  
    ;
    Labie, Riet  
    ;
    Sauter, Wolfgang
    ;
    Tremble, Eric
    ;
    Graf, Richard
    Proceedings paper
    2025, 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025-04-06

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