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Browsing by Author "Schervan, A."

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    Fine pitch copper wire bonding on copper bond pad process optimization

    Lam, Kan Wai
    ;
    Ho, Meng
    ;
    Stoukatch, Serguei
    ;
    Ratchev, Petar
    ;
    Vath, C.J.
    ;
    Schervan, A.
    ;
    Beyne, Eric  
    Proceedings paper
    2002, 4th International Symposium on Electronic Materials and Packaging, 3/12/2002, p.63-68

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