Browsing by Author "Schildermans, Inge"
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Publication Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Journal article2007, Microelectronics Reliability, (47) 2_3, p.215-222Publication Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly
Proceedings paper2005-04, Proceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics, 17/04/2005, p.675-680