Browsing by Author "Schmidt, Christian"
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Publication Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding
Proceedings paper2018, IEEE 68th Electronic Components and Technology Conference - ECTC, 29/05/2018, p.92-96Publication Use of 3D Xray microscopy for BEOL and advanced packaging failure analysis
Proceedings paper2017-11, International Symposium on Testing and Failure analysis - ISTFA, 5/11/2017, p.508-513