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Browsing by Author "Seppala, Emma"

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    3D stacked IC demonstration using a through silicon via first approach

    Van Olmen, Jan  
    ;
    Mercha, Abdelkarim  
    ;
    Katti, Guruprasad
    ;
    Huyghebaert, Cedric  
    ;
    Van Aelst, Joke  
    Proceedings paper
    2008, Technical Digest International Electron Devices Meeting - IEDM, 15/12/2008, p.603-606

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