Browsing by Author "Soper, A."
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Publication Damage evolution and mechanical failure in flip-chip interconnects
Proceedings paper1998, Electronic Packaging and Materials Science X, 14/04/1998, p.105-110Publication Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections
Proceedings paper1997, Proceedings of the International Conference and Exhibition Micro Materials - Micro Mat, 16/04/1997, p.261-266