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    3D interconnects for quantum computing

    Derakhshandeh, Jaber  
    ;
    Dangol, Anish  
    ;
    Hussain, Tassawar  
    ;
    Stegmann, Heiko
    Proceedings paper
    2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.821-828

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