Browsing by Author "Stokich, T."

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Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Waeterloos, Joost
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Shaffer, E. O.
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Stokich, T.
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Hetzner, J.
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Price, D.
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Booms, L.
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Donaton, R. A.
Proceedings paper
2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference, 1/06/2001, p.60-62
Mechanical analysis of a SiLK/Cu dual damascene interconnect system

Waeterloos, Joost
;
Shaffer, E.
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Stokich, T.
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Alves Donaton, Ricardo
;
Maex, Karen
Proceedings paper
2001, Advanced Metallization Conference 2000, 3/10/2000, p.469-473