Browsing by Author "Tabery, C."
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Publication Alignment and overlay through opaque metal layers
Proceedings paper2023, Conference on Metrology, Inspection, and Process Control XXXVII, FEB 27-MAR 02, 2023, p.Art. 124960IPublication Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration
Proceedings paper2024, 2024 International Interconnect Technology Conference, 2024-06-03Publication Design for manufacturability analysis in dual damascene 28nm-pitch single exposure EUV metal logic designs using voltage contrast
; ; ; ; Publication Electrical test demonstration for 0.55 NA EUV single patterning damascene process
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Patterning process and electrical yield optimization at the limits of single exposure EUV 0.33 NA: a pitch 26nm damascene process
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