Browsing by Author "Tekin, T."
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Publication 3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
Proceedings paper2019, IEEE 69th Electronic Components and Technology Conference - ECTC, 25/05/2019, p.1052-1059Publication CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
Publication ePIXpack - advanced smart packaging solutions for silicon photonics
Proceedings paper2008-06, 14th European Conference on Integrated Optics - ECIO, 11/06/2008, p.33-36Publication g-Pack - a generic testbed package for silicon photonics devices
Proceedings paper2008-09, 5th International Conference on Group IV Photonics, 17/09/2008, p.371-373