Browsing by Author "Tekin, T."

Now showing 1 - 5 of 5

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Sirbu, B.
;
Eichhammer, Y.
;
Oppermann, H.
;
Tekin, T.
;
Kraft, J.
;
Sidorov, V.
;
Yin, Xin
Proceedings paper
2019, IEEE 69th Electronic Components and Technology Conference - ECTC, 25/05/2019, p.1052-1059
Advanced 2.5D co-packaged optical solutions for high-efficiency AI workloads and cloud computing: delivering 6.4 Tb/s per port, towards 204Tb/s switch-ASICS

Sirbu, B.
;
Solarte, D. Hernandez
;
Chowdhury, B.
;
Symeonidis, M.
;
Anastasiadis, M.
;
Palaci, A.
Proceedings paper
2026, Optical Interconnects and Packaging, 2026-01-17, p.139030J
CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment

Galan, V.J.
;
Sanchis, P.
;
Marti, J.
;
Marx, S.
;
Schröder, H.
;
Murhopadhyay, B.
;
Tekin, T.
Proceedings paper
2009, 6th IEEE International Conference on Group IV Photonics, 9/09/2009, p.148-150
ePIXpack - advanced smart packaging solutions for silicon photonics

Zimmerman, L.
;
Schroder, H.
;
Dumon, Pieter
;
Bogaerts, Wim
;
Tekin, T.
Proceedings paper
2008, 14th European Conference on Integrated Optics - ECIO, 11/06/2008, p.33-36
g-Pack - a generic testbed package for silicon photonics devices

Zimmermann, L.
;
Schroder, H.
;
Tekin, T.
;
Dumon, Pieter
;
Bogaerts, Wim
Proceedings paper
2008, 5th International Conference on Group IV Photonics, 17/09/2008, p.371-373