Browsing by Author "Tremble, Eric"
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Publication BGA electromigration behavior and why it has become the bottleneck
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.678-684Publication Thermal analysis and electromigration behaviour in BGA packages: investigating the impact of electric current and resultant Joule heating on temperature distribution
Proceedings paper2025, 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025-04-06