Browsing by Author "Tyrovouzi, Anna-Maria"
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Publication 3D IC interconnects: microbump yield electrical characterization and TSV modeling
Proceedings paper2014, Electrical and Computer Engineering Greek Student Conference, 11/04/2014Publication Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Journal article2015, Japanese Journal of Applied Physics, (54) 5S, p.05EE01