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Browsing by Author "Van Messem, Laura"

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    A 4 x 4 Millimeterwave-Frequency Butler Matrix in Grounded Co-Planar Waveguide Technology for Compact Integration With 5G Antenna Arrays

    Van Messem, Laura  
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    Moerman, Arno  
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    Caytan, Olivier  
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    Lima de Paula, Igor  
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    Hoflack, Bram  
    Journal article
    2023, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, (71) 1, p.122-134
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    Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

    Van Messem, Laura
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    Sinha, Siddhartha  
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    Ocket, Ilja  
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    Trischler, Heinrich
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    Schlaffer, Erich
    Journal article
    2023, SCIENTIFIC REPORTS, (13) 1, p.Art. 16714
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    Consistent and Cost-Effective PCB-Based D-B and Air-Filled Substrate-Integrated-Waveguide Filters

    Van Messem, Laura  
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    Broucke, Reinier  
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    Rogier, Hendrik  
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    Sinha, Siddhartha  
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    Ocket, Ilja  
    Proceedings paper
    2023, 2nd IEEE-MTT-S International Microwave Filter Workshop (IMFW), FEB 21-23, 2024, p.167-169
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    Packaged Cost-Effective Millimeterwave Air-Filled SIW Components for Array Feed Networks

    Van Messem, Laura  
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    Moerman, Arno  
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    Caytan, Olivier  
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    Vande Ginste, Dries  
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    Rogier, Hendrik  
    Proceedings paper
    2023, IEEE Conference on Electrical Design of Advanced Packaging and Systems (IEEE EPS EDAPS) - Semiconductor Packaging - The Next Frontier, DEC 12-14, 2023
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    Single-fed 3 x 3 substrate-integrated waveguide parasitic antenna array for 24 GHz radar applications

    Deckmyn, Thomas
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    Caytan, Olivier  
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    Bosman, Dries  
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    Lima de Paula, Igor  
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    Van Messem, Laura  
    Journal article
    2018-11, IEEE Transactions on Antennas and Propagation, (66) 11, p.5955-5963
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    Substrate Integrated Coaxial Line Millimeterwave Components Manufactured in Standard PCB

    Van Messem, Laura  
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    Moerman, Arno  
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    Caytan, Olivier  
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    Rogier, Hendrik  
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    Lemey, Sam  
    Proceedings paper
    2023, IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), OCT 15-18, 2023
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    Substrate Integrated Components for Passive Millimeterwave-Frequency Beamforming Networks

    Van Messem, Laura  
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    Moerman, Arno  
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    Caytan, Olivier  
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    Lima de Paula, Igor  
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    Hoflack, Bram
    Proceedings paper
    2021, IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), NOV 15-17, 2021, p.272-274
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    Substrate-Integrated Coaxial Line Fed Air-Filled SIW Antenna for the 28 GHz 5G Bands

    Van Messem, Laura  
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    Moerman, Arno  
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    Caytan, Olivier  
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    Rogier, Hendrik  
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    Lemey, Sam  
    Proceedings paper
    2024, 54th European Microwave Conference (EuMC), SEP 24-26, 2024, p.453-456
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    System-Level Model for mmWave-over-Fiber Distributed Antenna Systems

    Moerman, Arno  
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    Caytan, Olivier  
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    Van Messem, Laura  
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    Lima de Paula, Igor  
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    Van Kerrebrouck, Joris  
    Proceedings paper
    2022, IEEE International Symposium on Phased Array Systems and Technology (PAST), OCT 11-14, 2022
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    System-Level Simulation Suite for the Design of mmWave-Over-Fiber-Based Distributed Antenna Systems

    Moerman, Arno  
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    Caytan, Olivier  
    ;
    Van Messem, Laura  
    ;
    Van Kerrebrouck, Joris  
    ;
    Torfs, Guy  
    Journal article
    2023, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, (71) 12, p.5082-5094

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