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Browsing by Author "Van den Berghe, R."

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    Flip-chip assembly for chips with gold bumps on high density thic film substrates

    Vrana, M.
    ;
    Van Calster, Andre  
    ;
    Van den Berghe, R.
    ;
    Allaert, K.
    Proceedings paper
    1997, Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy., p.175-182

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