Browsing by Author "Vendier, Olivier"
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Publication A new ultra-thin 3D integration technique: technological and thermal investigations
Proceedings paper2000, Design, Test, Integration, and Packaging of MEMS/MOEMS, 9/05/2000, p.324-332Publication ENDORFINS: Enabling deployment of RF MEMS technology in space telecommunication
Proceedings paper2007, 6th ESA Round Table on Micro & Nano Technologies for Space Applications, 8/10/2007Publication Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies
Proceedings paper2005-06, Proceedings 55th Electronic Components and Technology Conference - ECTC, 31/05/2005, p.1664-1669Publication Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies
Journal article2007-08, IEEE Trans. Advanced Packaging, (30) 3, p.369-376