Browsing by Author "Vereeken, Maria"
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Publication Electroless nickel plating bath composition and replenishment for microvia plating process
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.447-452Publication HIPERPRINT= a board technology for high-frequency applications
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.326-332Publication Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Journal article1999, J. Electrochem. Soc., (146) 8, p.2870-2875Publication Standard SMT process for flip-chip assembly on FR4 substrate
Publication The fabrication and reliability of a photovia test vehicle for MCM-L applciations
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.53-58Publication The realisation of photo-via technology using multiposit as a photo imageable dielectric
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.62-65Publication Two-layer silicon hybrids interconnect
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.162-171Publication Two-layer silicon hybrids interconnect technology
Proceedings paper1995, Proceedings 1995 International Conference on Multichip Modules; April 1995; Denver, Colorado, USA., p.375-380