Browsing by Author "Vrana, M."
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Publication A paper-white chip-based display MCM package for portable IT products
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.543-547Publication Flip-chip assembly for chips with gold bumps on high density thic film substrates
Proceedings paper1997, Proceedings of the 11th European Microelectronics Conference; 14-16 May 1997. Venice, Italy., p.175-182Publication High density thick film multilayers with Ag-based conductors
Proceedings paper1998, Proceedings IMAPS International Symposium on Microelectronics, 1/11/1998, p.789-794Publication Interconnection technology for advanced high density thick films
Proceedings paper1995, Proceedings of the 10th European Microelectronics Conference; May 1995; Copenhagen, Denmark., p.190-198Publication Low cost high density multilayer interconnection technology
Proceedings paper1998, Proceedings of the 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnectio, 15/06/1998, p.129-133Publication MCMs and High Density Interconnections in Thick Film Technology
Vrana, M.PHD thesis1998-06Publication Multichannel optical modules compatible with the fibre in board technology
Publication Multifibre Electro-Optical Modules Compatible with the Fibre in Board Technology
Publication Photo-imageable thick films for multichip modules
; Publication Photoimaginable thick films for multi chip modules
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