Browsing by Author "Werkhoven, D."
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Publication Brittle to ductile fracture transition in bulk Pb-free solders
Journal article2007, IEEE Trans. Components and Packaging Technologies, (30) 3, p.416-423Publication Improving the QFN Board level Reliability using Low Melting LMPAQ Solder
Proceedings paper2020, IEEE Reliability for Electronics and Photonics Packaging Symposium - REPP, 12/11/2020