Browsing by Author "Werkhoven, Daniel"
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Publication A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Proceedings paper2005, Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC, 12/06/2005, p.248-252Publication ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Proceedings paper2021, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), OCT 26-28, 2021Publication Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Proceedings paper2019, 20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 24/03/2019, p.1-5Publication In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
Proceedings paper2017, 18th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 2/04/2017, p.1-5