Browsing by Author "Yu, Qiulin"
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Publication Application of machine learning modeling for predicting the reliability of solder joints under thermal cycling
Journal article2025, MICROELECTRONICS RELIABILITY, 174, p.115900Publication Heat Sink Effects in Power Module Design: Multiphysics Simulation with Multiple Heat Sources
Proceedings paper2025, 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025-04-06