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Browsing by Author "van der Sluis, Olaf"

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    Delamination of metal-polymer interfaces in microelectronics

    van der Sluis, Olaf
    ;
    Hsu, Yung-Yu
    ;
    Noijen, Sander
    ;
    Timmermans, Peter
    ;
    Gonzalez, Mario  
    Proceedings paper
    2010, IV European Conference on Computational Mechanics - ECCM IV, 16/05/2010
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    Design and implementation of flexible and stretchable systems

    Gonzalez, Mario  
    ;
    Vandevelde, Bart  
    ;
    Christiaens, Wim
    ;
    Hsu, Yung-Yu
    ;
    Iker, Francois
    Journal article
    2011, Microelectronics Reliability, (51) 6, p.1069-1076
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    From fibrils to toughness: multi-scale mechanics of fibrillating interfaces in stretchable electronics

    van der Sluis, Olaf
    ;
    Vermeij, Tijmen
    ;
    Neggers, Jan
    ;
    Vossen, Bart
    ;
    van Maris, Marc
    ;
    Vanfleteren, Jan  
    Journal article
    2019, Materials, (11) 2, p.231
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    Numerical and experimental analysis of stretching induced interconnect delamination

    van der Sluis, Olaf
    ;
    Hsu, Yung-Yu
    ;
    Timmermans, P.H.M.
    ;
    Gonzalez, Mario  
    ;
    Hoefnagels, J.P.M.
    Oral presentation
    2009, Flexable & Stretchable Electronics Workshop
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    Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits

    van der Sluis, Olaf
    ;
    Hsu, Yung-Yu
    ;
    Timmermans, P.H.M.
    ;
    Gonzalez, Mario  
    ;
    Hoefnagels, J.P.M.
    Meeting abstract
    2010, 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale, 30/08/2010
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    Stretching-induced interconnect delamination in stretchable electronic circuits

    van der Sluis, Olaf
    ;
    Hsu, Yung-Yu
    ;
    Timmermans, P H M
    ;
    Gonzalez, Mario  
    ;
    Hoefnagels, J P M
    Journal article
    2011, Journal of Physics D: Applied Physics, (44) 3, p.34008
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    Thermo-mechanical analysis of flexible and stretchable systems

    Gonzalez, Mario  
    ;
    Vandevelde, Bart  
    ;
    Christiaens, Wim
    ;
    Hsu, Yung-Yu
    ;
    Iker, Francois
    Proceedings paper
    2010, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE, 25/04/2010, p.175-181

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