Browsing by author "Vervaet, A."

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Siau, S.; Vervaet, A.; Van Vaeck, L.; Schacht, E.; Demeter, U.; Van Calster, Andre (2005)

ASIC chip, hybrid multisensor, and package co-design for smart gas monitoring module

Reczey, M.; Dobay, R.; Harsanyi, G.; Illyefalvi-Vitez, Z.; Van Den Steen, Jean; Vervaet, A.; Reinert, W.; Urbancik, J.; Guljaev, A.; Visy, C.; Barsony, I. (1998)

Cheap multichip modules

Illyefalvi-Vitez, Z.; Vervaet, A.; Van Calster, Andre; Sinnadurai, N.; Hrovat, M.; Svasta, P.; Toth, E.; Belavic, D.; Ionescu, R.; Dennehy, W. (1999)

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Siau, S.; Vervaet, A.; Schacht, E.; Callewaert, K.; Van Calster, Andre; Degrande, S. (2005)

Combining inorganic and organic gas sensor elements: a new approach for multicomponent sensing

Réczey, M.; Lepsényi, I.; Reichardt, A.; Harsanyi, G.; Dobay, R.; Schön, A.; Illyefalvi-Vitéz, Z.; Van Den Steen, Jean; Vervaet, A.; Reinert, W.; Urbancik, J.; Guljajev, A.; Visy, C.; Inzelt, G.; Barsony, I. (1999)

Combining inorganic and organic sensor elements: a new approach for multi-component sensing

Harsanyi, G.; Réczey, M.; Dobay, R.; Lepsényi, I.; Illyefalvi-Vitéz, Z.; Van Den Steen, Jean; Vervaet, A.; Reinert, W.; Urbancik, J.; Guljajev, A.; Visy, C.; Inzelt, G.; Barsony, I. (1999)

Determination of the state-of-health of VRLA batteries by means of noise measurements

Baert, D.; Vervaet, A. (2001)

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Siau, S.; Vervaet, A.; Degrande, S.; Schacht, E; Van Calster, Andre (2005)

Electroless nickel-gold stud bumping on laminate for flip-chip assembly

Zang, S.; Vereecken, M.; De Baets, J.; Van Calster, Andre; Vervaet, A.; Peeters, Joris; Allaert, K. (1997)

Excimer laser microvia technology in MCMs

Manirambona, B.; De Baets, Johan; Vervaet, A. (2002)

Excimer laser microvia-technology in multichip modules

Manirambona, B.; De Baets, Johan; Vervaet, A. (2003)

Highlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applications

Vanfleteren, Jan; Vervaet, A.; Van Calster, Andre (2000)

Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Siau, Sam; Vervaet, A.; Van Calster, Andre; Schacht, E. (2004)

Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper

Siau, S.; Vervaet, A.; Schacht, E.; Van Calster, Andre (2005-05)