Browsing by author "van de Wiel, H.J."

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Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending

van den Ende, Daan; van de Wiel, H.J.; Kusters, Roel; Sridhar, Ashok; Schram, Jeroen; Cauwe, Maarten; van den Brand, Jeroen (2014)
Residual stress in silicon caused by Cu-Sn wafer-level packaging

Taklo, Maaike; Vardĝy, Astrid-Sofie; De Wolf, Ingrid; Simons, Veerle; van de Wiel, H.J.; van der Waal, Adri; Martinsen, Stian; Lapadatu, Adriana; Wunderle, Bernhard (2013)