Publication:

Residual stress in silicon caused by Cu-Sn wafer-level packaging

Date

2013

Meeting abstract

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Author(s)

;

Vardĝy, Astrid-Sofie

;

De Wolf, Ingrid

;

;

van de Wiel, H.J.

;

van der Waal, Adri

;

Martinsen, Stian

;

Lapadatu, Adriana

;

Wunderle, Bernhard

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Acq. date: 2026-04-06