Authors

Taklo, Maaike; Vardĝy, Astrid-Sofie; De Wolf, Ingrid; Simons, Veerle; van de Wiel, H.J.; van der Waal, Adri; Martinsen, Stian; Lapadatu, Adriana; Wunderle, Bernhard

Conference

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK

Title

Residual stress in silicon caused by Cu-Sn wafer-level packaging

Publication type

Meeting abstract