Publication:

Residual stress in silicon caused by Cu-Sn wafer-level packaging

Date

2013
Meeting abstract
Simple item page Full metadata Statistics
 
dc.contributor.authorTaklo, Maaike
dc.contributor.authorVardĝy, Astrid-Sofie
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSimons, Veerle
dc.contributor.authorvan de Wiel, H.J.
dc.contributor.authorvan der Waal, Adri
dc.contributor.authorMartinsen, Stian
dc.contributor.authorLapadatu, Adriana
dc.contributor.authorWunderle, Bernhard
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorSimons, Veerle
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.date.accessioned2021-10-21T12:33:52Z
dc.date.available2021-10-21T12:33:52Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23148
dc.source.beginpage73317
dc.source.conferenceInternational Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK
dc.source.conferencedate16/07/2013
dc.source.conferencelocationBurlingame CA, USA
dc.title

Residual stress in silicon caused by Cu-Sn wafer-level packaging

dc.typeMeeting abstract
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions