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Residual stress in silicon caused by Cu-Sn wafer-level packaging
Publication:
Residual stress in silicon caused by Cu-Sn wafer-level packaging
Date
2013
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Taklo, Maaike
;
Vardĝy, Astrid-Sofie
;
De Wolf, Ingrid
;
Simons, Veerle
;
van de Wiel, H.J.
;
van der Waal, Adri
;
Martinsen, Stian
;
Lapadatu, Adriana
;
Wunderle, Bernhard
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Abstract
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1968
since deposited on 2021-10-21
Acq. date: 2025-10-27
Citations
Metrics
Views
1968
since deposited on 2021-10-21
Acq. date: 2025-10-27
Citations