Browsing by author "Hua, Fay"

Now showing items 1-2 of 2

Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Vakanas, George; Wang, Teng; Tatsumi, Koji; Marinissen, Erik Jan; Rebibis, Kenneth June; Cherman, Vladimir; Croes, Kristof; Hua, Fay; De Wolf, Ingrid; Beyne, Eric (2014)
Whisker evaluations in 3D microbump structures

Vakanas, George; Vandecasteele, Bjorn; De Messemaeker, Joke; Willems, Geert; La Manna, Antonio; Pei, Fei; Chason, Eric; Hua, Fay; De Wolf, Ingrid (2014)