Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Publication:
Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking
Copy permalink
Date
2014
Meeting abstract
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
27513.pdf
37.27 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vakanas, George
;
Wang, Teng
;
Tatsumi, Koji
;
Marinissen, Erik Jan
;
Rebibis, Kenneth June
;
Cherman, Vladimir
;
Croes, Kristof
;
Hua, Fay
;
De Wolf, Ingrid
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1861
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations
Metrics
Views
1861
since deposited on 2021-10-22
Acq. date: 2025-12-12
Citations