Publication:

Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Date

2014
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Author(s)

Vakanas, George
;
Wang, Teng
;
Tatsumi, Koji
;
Marinissen, Erik Jan  
;
Rebibis, Kenneth June  
;
Cherman, Vladimir  
;
Croes, Kristof  
;
Hua, Fay
;
De Wolf, Ingrid  
;
Beyne, Eric  

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