Publication:

Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Date

2014
Meeting abstract
Simple item page Full metadata Statistics
 
dc.contributor.authorVakanas, George
dc.contributor.authorWang, Teng
dc.contributor.authorTatsumi, Koji
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCroes, Kristof
dc.contributor.authorHua, Fay
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-22T06:55:00Z
dc.date.available2021-10-22T06:55:00Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24657
dc.identifier.urlhttp://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/43CE740C1845254685257B98004437BA?OpenDocument
dc.source.conferenceTMS Annual Meeting & Exhibition
dc.source.conferencedate16/02/2014
dc.source.conferencelocationSan Diego, CA USA
dc.title

Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
27513.pdf
Size:
37.27 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions